TECHNOLOGICAL COMPETENCIES
From material elaboration up to system integration
To meet the needs of the diverse nanoscale community, the multi-site Renatech network provides the necessary expertise and state-of-the art equipment for a broad spectrum of technologies from transversal up to very specific one:
MATERIAL/GROWTH
- MBE/MOCVD
- UHV-CVD
- Chemical synthesis
- ALD
- Thermal processing ion implantation
LITHOGRAPHY
- E-Beam
- UV and deep UV
- Laser
- Nanoimprint
DEPOSITION
- PVD (evaporation/sputtering)
- PECVD/LPCVD
- Electrodeposition
- Alternative technologies
(ink jet, screen printing)
ETCHING
- Chemical
- Plasma
- FIB, nano FIB
CHARACTERIZATION / METROLOGY
- Optical microscopy
- AFM/STM/SEM/TEM
- Profilometry
- Ellipsometry
- Optical and electrical measurements
- X-Ray Diffraction
INTEGRATION
- Chip packaging
- Grinding
- Pick and place
- Wire bonding
- Flip chip wafer level packaging
- Wafer bonding
- Screen printing