KNOW-HOW AND RESOURCES
- An ambitious partner community of large technological facilities distributed over the national territory and located in 5 laboratories Strongly involved in research and technological development
- A coherent and mutualized infrastructure of:
- the top level equipment thanks to a national investment policy
- excellent technological know-how and high-level scientific expertise
- open access plateforms
- coordinated research programs
Renatech’s clean rooms
FEMTO-ST
PLATEFORME MIMENTO
Besançon
Clean room: 865 m² (ISO 5 to 7)
Main research themes: Micro and nano acoustics, Micro and Nano optics, Microrobotics, Silicon, MOEMS
R&D technology: 12 members technical staff
Specific tools: AIN deposition, E-Beam lithography,
Spray coating, Dry plasma etching (Si, quartz, LINbO3),FIB,
Wafer bonding, Precision dicing, Mechanical characterization,
Industrial production line for plezoelectric components.
Clean room: 1 600 m² (ISO 4 to 6)
Main research themes: System integration: RF, Energy, Photonics, Micro and nano systems for biology, Health and environment
R&D technology: 36 members technical staff
Specific tools: Lithography (E-beam, Laser, UV by projection), PVD, Electroplating, PECVD, LPCVD, ALD, DRIE, Ion implantation, FIB, Ink jet, Screen printing, Die thinning and assembly
IEMN
Lille
Clean room: 1 600 m² (ISO 5 to 6)
Main research themes: III-V Electronics, Flexible electronics, Nano characterization, MEMS-NEMS
R&D technology: 22 members technical staff
Specific tools: III-V epitaxy, E-Beam lithography, III-V/SI ICP plasma etching, LPCVD, PECVD, Ion implantation, FIB, AFM/STM, Four probes STM
LTM
Grenoble
Clean room: 1 200 m² (ISO 4 to 6)
Main research themes: Nano electronics, Spintronics, Nano systems
R&D technology: 32 members technical staff
Specific tools: E-Beam lithography, etching/deposition metals and oxides, Micro/nano systems, CMP, UVtherm NIL, FIB dual beam
Clean romme: 2900 m² (ISO 4 to 7)
Main research themes: Silicium for Nano photonic, Spintronic, Opto electronic devices, Micro systems, III-V nano photonic, Quantum nano electronic, Micro fluidic
R&D technology: 64 members technical staff
Specific tools : IV-IV epitaxy, Magnetic thin layers, E-Beam lithography, Deep-UV lithography, Direct laser writing, ICP deep etching of silicon, Optical vibrometry, III-V epitaxy (MBE, MOCVD), E-Beam lithography tools, III-V deep etching, NanoFIB, AFM/STM, nanoimprint lithography tools, STEM with correction of aberration, 3D lithography, Xray analysis